Beneq announced that together with Fraunhofer’s COMEDD, they have developed a new R&D thin film ALD encapsulation system for 200×200 mm OLED and OPV substrates. This system is now available – and in a few months they will deliver the first one to COMEDD.
The new encapsulation system is based on a cross-flow reactor, which has been optimized for the shortest possible cycle time, even at low processing temperatures, such as under 100 Celsius. It allows for rapid OLED prototyping and enables process scale-up for large areas and high throughput. Beneq’s new system can be used as a stand-alone system, and it can also be integrated with an MBraun glove box.
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